Title: Modeling of water absorption induced cracks in resin-based composite supported ceramic layer structures Author(s): HUANG,M.; THOMPSON,V.P.; REKOW,E.D.; et al. Source: Journal of Biomedical Materials Research Part B-Applied Biomaterials Volume: 84B Issue: 1 Pages: 124-130 Published: 2008
added
27-Jul-08
2.
Title: Creep induced rate effects on radial cracks in multilayered structures Author(s): HUANG, M.; NIU, X.; SOBOYEJO,W.O. Source: Journal of Materials Science-Materials in Medicine Volume: 18 Issue: 1 Pages: 65-69 Published: 2007
added
27-Jul-08
3.
Title: Bioinspired design of dental multilayers Author(s): HUANG, M.; WANG, R.; THOMPSON,V.P.; et al. Source: Journal of Materials Science-Materials in Medicine Volume: 18 Pages: 57-64 Published: 2007
added
27-Jul-08
4.
Title: Substrate creep on the fatigue life of a model dental multilayer structure Author(s): ZHOU, J.; HUANG, M.; NIU, X.; et al. Source: Journal of Biomedical Materials Research Part B-Applied Biomaterials Volume: 82B Issue: 2 Pages: 374-382 Published: 2007
added
27-Jul-08
5.
Title: The influence of light propagation direction on the stress induced polarization dependence of silicon waveguides Author(s): HUANG, M. Source: IEEE Photonics Technology Letters Volume: 18 Issue: 12 Pages: 1314-1316 Published: 2006
added
27-Jul-08
6.
Title: Interfacial failure of a dental cement composite bonded to glass substrates Author(s): ZHOU, J.; HUANG, M.; SAGNANG, F.; et al. Source: Dental Materials Volume: 22 Issue: 6 Pages: 585-591 Published: 2006
added
27-Jul-08
7.
Title: Contact damage of dental multilayers: viscous deformation and fatigue mechanisms Author(s): HUANG,M.; NIU, X.; SHROTRIYA, P.; et al. Source: Journal of Engineering Materials and Technology-Transactions of the ASME Volume: 127 Pages: 33-39 Published: 2005
added
27-Jul-08
8.
Title: Exploring transistor width effect on stress-induced performance improvement in PMOSFET with SiGe source/drain Author(s): WANG, X.; HUANG, M.; BOWEN, C.; et al. Conference: International Conference on Simulation of Semiconductor Processes and Devices Pages: 323-326 Year: 2005
added
27-Jul-08
9.
Title: Phenomenological model for "stress memorization" effect from a capped-poly process Author(s): ADAM, L.S.; CHIU, C.; HUANG, M.; et al. Conference: International Conference on Simulation of Semiconductor Processes and Devices Pages: 139-142 Year: 2005
added
27-Jul-08
10.
Title: Analytical solutions for thermal stresses in buried channel waveguides Author(s): HUANG, M. Source: IEEE Journal of Quantum Electronics Volume: 40 Issue: 11 Pages: 1562-1568 Published: 2005
