Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Author(s): YEH, CL; LAI, YS Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 10 Pages: 1892-1901 Published: OCT 2006 Times Cited: 19
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Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Author(s): HUANG, AT; TU, KN; LAI, YS Source: JOURNAL OF APPLIED PHYSICS Volume: 100 Issue: 3 Published: AUG 1 2006 Times Cited: 19 DOI: 10.1063/1.2227621
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Title: Characteristics of current crowding in flip-chip solder bumps Author(s): LAI, YS; KAO, CL Conference: 26th Annual EOS/ESD Symposium Volume: 46 Pages: 915-922 Year: MAY-JUN 2006 Times Cited: 17 DOI: 10.1016/j.microrel.2005.02.007
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Title: Local melting induced by electromigration in flip-chip solder joints Author(s): TSAI, CM; LIN, YL; TSAI, JY; et al. Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 5 Pages: 1005-1009 Published: MAY 2006 Times Cited: 17
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10.
Title: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages Author(s): LAI, YS; KAO, CL Conference: Workshop on Reliability of Compound Semiconductors (ROCS) Volume: 46 Pages: 1357-1368 Year: AUG 2006 Times Cited: 16 DOI: 10.1016/j.microrel.2005.08.009
