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ResearcherID: B-2905-2008 Last / Family Name: First / Given Name:
URL: http://www.researcherid.com/rid/B-2905-2008
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Sub-org/Dept: Central Labs
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Publication List Citation Metrics
publication(s)
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1. Title: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
Author(s): LAI, YS; YANG, PF; YEH, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 2-4 Pages: 645-650 Year: FEB-APR 2006
Times Cited: 19
added
02-Jun-08
2. Title: Thermomigration in SnPb composite flip chip solder joints
Author(s): HUANG, AT; GUSAK, AM; TU, KN; et al.
Source: APPLIED PHYSICS LETTERS Volume: 88 Issue: 14 Year: APR 3 2006
Times Cited: 18
added
02-Jun-08
3. Title: Local melting induced by electromigration in flip-chip solder joints
Author(s): TSAI, CM; LIN, YL; TSAI, JY; et al.
Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 5 Pages: 1005-1009 Year: MAY 2006
Times Cited: 11
added
02-Jun-08
4. Title: Support excitation scheme for transient analysis of JEDEC board-level drop test
Author(s): YEH, CL; LAI, YS
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 2-4 Pages: 626-636 Year: FEB-APR 2006
Times Cited: 11
added
02-Jun-08
5. Title: Evaluation of board-level reliability of electronic packages under consecutive drops
Author(s): YEH, CL; LAI, YS; KAO, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 7 Pages: 1172-1182 Year: JUL 2006
Times Cited: 11
DOI: 10.1016/j.microre1.2005.09.002
added
01-Sep-08
6. Title: Micromechanical analysis of imperfectly bonded layered media
Author(s): LAI, YS; WANG, CY; TIEN, YM
Source: JOURNAL OF ENGINEERING MECHANICS-ASCE Volume: 123 Issue: 10 Pages: 986-995 Year: OCT 1997
Times Cited: 11
added
16-Sep-08
7. Title: Characteristics of current crowding in flip-chip solder bumps
Author(s): LAI, YS; KAO, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 915-922 Year: MAY-JUN 2006
Times Cited: 10
added
02-Jun-08
8. Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
Author(s): HUANG, AT; TU, KN; LAI, YS
Source: JOURNAL OF APPLIED PHYSICS Volume: 100 Issue: 3 Year: AUG 1 2006
Times Cited: 9
added
02-Jun-08
9. Title: Transient fracturing of solder joints subjected to displacement-controlled impact loads
Author(s): YEH, CL; LAI, YS
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 885-895 Year: MAY-JUN 2006
Times Cited: 9
added
02-Jun-08
10. Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test
Author(s): YEH, CL; LAI, YS
Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 10 Pages: 1892-1901 Year: OCT 2006
Times Cited: 8
added
02-Jun-08
publication(s)
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