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Lai, Yi-Shao
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ResearcherID: B-2905-2008
URL: http://www.researcherid.com/rid/B-2905-2008
Subject: Engineering; Mechanics
Keywords: electronic packaging; finite element analysis; electromigration; nanomechanics; multiphysics simulation; thermomechanical reliability of microelectronics
My Institutions (more details)
Primary Institution:
Sub-org/Dept: Central Product Solutions
Role:
 

Publications

My Publications (118)

 
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publication(s)  
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1. Title: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
Author(s): LAI, YS; YANG, PF; YEH, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 2-4 Pages: 645-650 Published: FEB-APR 2006
Times Cited: 70
DOI: 10.1016/j.microrel.2005.07.005
added
30-Jan-10
2. Title: Thermomigration in SnPb composite flip chip solder joints
Author(s): HUANG, AT; GUSAK, AM; TU, KN; et al.
Source: APPLIED PHYSICS LETTERS Volume: 88 Issue: 14 Published: APR 3 2006
Times Cited: 43
DOI: 10.1063/1.2192694
added
30-Jan-10
3. Title: Support excitation scheme for transient analysis of JEDEC board-level drop test
Author(s): YEH, CL; LAI, YS
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 2-4 Pages: 626-636 Published: FEB-APR 2006
Times Cited: 29
DOI: 10.1016/j.microrel.2004.12.021
added
30-Jan-10
4. Title: Evaluation of board-level reliability of electronic packages under consecutive drops
Author(s): YEH, CL; LAI, YS; KAO, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 7 Pages: 1172-1182 Published: JUL 2006
Times Cited: 25
DOI: 10.1016/j.microre1.2005.09.002
added
30-Jan-10
5. Title: Transient fracturing of solder joints subjected to displacement-controlled impact loads
Author(s): YEH, CL; LAI, YS
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 885-895 Published: MAY-JUN 2006
Times Cited: 24
DOI: 10.1016/j.microrel.2005.07.113
added
30-Jan-10
6. Title: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages
Author(s): LAI, YS; KAO, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 8 Pages: 1357-1368 Published: AUG 2006
Times Cited: 22
DOI: 10.1016/j.microrel.2005.08.009
added
30-Jan-10
7. Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
Author(s): HUANG, AT; TU, KN; LAI, YS
Source: JOURNAL OF APPLIED PHYSICS Volume: 100 Issue: 3 Published: AUG 1 2006
Times Cited: 22
DOI: 10.1063/1.2227621
added
30-Jan-10
8. Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test
Author(s): YEH, CL; LAI, YS
Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 10 Pages: 1892-1901 Published: OCT 2006
Times Cited: 22
added
30-Jan-10
9. Title: Characteristics of current crowding in flip-chip solder bumps
Author(s): LAI, YS; KAO, CL
Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 915-922 Published: MAY-JUN 2006
Times Cited: 21
DOI: 10.1016/j.microrel.2005.02.007
added
30-Jan-10
10. Title: Local melting induced by electromigration in flip-chip solder joints
Author(s): TSAI, CM; LIN, YL; TSAI, JY; et al.
Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 5 Pages: 1005-1009 Published: MAY 2006
Times Cited: 20
added
30-Jan-10
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