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Lai, Yi-Shao
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ResearcherID: B-2905-2008
URL: http://www.researcherid.com/rid/B-2905-2008
Subject: Engineering; Mechanics
Keywords: electronic packaging; finite element analysis; electromigration; nanomechanics; multiphysics simulation; thermomechanical reliability of microelectronics
My Institutions (more details)
Primary Institution:
Sub-org/Dept: Central Product Solutions
Role:
 

My Publications

My Publications(140)

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This list contains papers that I have authored.

    
publication(s)  
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1. Title: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
Author(s): Lai, YS; Yang, PF; Yeh, CL
Source: Microelectronics Reliability Volume: 46 Issue: 2-4 Pages: 645-650 Published: FEB-APR 2006
Times Cited: 84
DOI: 10.1016/j.microrel.2005.07.005
added
24-Nov-11
2. Title: Thermomigration in SnPb composite flip chip solder joints
Author(s): Huang, AT; Gusak, AM; Tu, KN; et al.
Source: Applied Physics Letters Volume: 88 Issue: 14 Published: APR 3 2006
Times Cited: 51
DOI: 10.1063/1.2192694
added
24-Nov-11
3. Title: Support excitation scheme for transient analysis of JEDEC board-level drop test
Author(s): Yeh, CL; Lai, YS
Source: Microelectronics Reliability Volume: 46 Issue: 2-4 Pages: 626-636 Published: FEB-APR 2006
Times Cited: 33
DOI: 10.1016/j.microrel.2004.12.021
added
24-Nov-11
4. Title: Evaluation of board-level reliability of electronic packages under consecutive drops
Author(s): Yeh, Chang-Lin; Lai, Yi-Shao; Kao, Chin-Li
Source: Microelectronics Reliability Volume: 46 Issue: 7 Pages: 1172-1182 Published: JUL 2006
Times Cited: 31
DOI: 10.1016/j.microrel.2005.09.002
added
24-Nov-11
5. Title: Transient fracturing of solder joints subjected to displacement-controlled impact loads
Author(s): Yeh, CL; Lai, YS
Source: Microelectronics Reliability Volume: 46 Issue: 5-6 Pages: 885-895 Published: MAY-JUN 2006
Times Cited: 28
DOI: 10.1016/j.microrel.2005.07.113
added
24-Nov-11
6. Title: Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
Author(s): Lai, Yi-Shao; Chen, Kuo-Ming; Kao, Chin-Li; et al.
Source: Microelectronics Reliability Volume: 47 Issue: 8 Pages: 1273-1279 Published: AUG 2007
Times Cited: 26
DOI: 10.1016/j.microrel.2006.09.023
added
24-Nov-11
7. Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test
Author(s): Yeh, Chang-Lin; Lai, Yi-Shao
Source: Journal of Electronic Materials Volume: 35 Issue: 10 Pages: 1892-1901 Published: OCT 2006
Times Cited: 26
DOI: 10.1007/s11664-006-0173-2
added
24-Nov-11
8. Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
Author(s): Huang, Annie T.; Tu, K. N.; Lai, Yi-Shao
Source: Journal of Applied Physics Volume: 100 Issue: 3 Published: AUG 1 2006
Times Cited: 26
DOI: 10.1063/1.2227621
added
24-Nov-11
9. Title: Local melting induced by electromigration in flip-chip solder joints
Author(s): Tsai, CM; Lin, YL; Tsai, JY; et al.
Source: Journal of Electronic Materials Volume: 35 Issue: 5 Pages: 1005-1009 Published: MAY 2006
Times Cited: 26
DOI: 10.1007/BF02692560
added
24-Nov-11
10. Title: Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
Author(s): Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; et al.
Source: Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing Volume: 485 Issue: 1-2 Pages: 305-310 Published: JUN 25 2008
Times Cited: 24
DOI: 10.1016/j.msea.2007.07.093
added
24-Nov-11
publication(s)  
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