Title: Local melting induced by electromigration in flip-chip solder joints Author(s): TSAI, CM; LIN, YL; TSAI, JY; et al. Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 5 Pages: 1005-1009 Year: MAY 2006 Times Cited: 11
added
02-Jun-08
4.
Title: Support excitation scheme for transient analysis of JEDEC board-level drop test Author(s): YEH, CL; LAI, YS Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 2-4 Pages: 626-636 Year: FEB-APR 2006 Times Cited: 11
added
02-Jun-08
5.
Title: Evaluation of board-level reliability of electronic packages under consecutive drops Author(s): YEH, CL; LAI, YS; KAO, CL Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 7 Pages: 1172-1182 Year: JUL 2006 Times Cited: 11 DOI: 10.1016/j.microre1.2005.09.002
added
01-Sep-08
6.
Title: Micromechanical analysis of imperfectly bonded layered media Author(s): LAI, YS; WANG, CY; TIEN, YM Source: JOURNAL OF ENGINEERING MECHANICS-ASCE Volume: 123 Issue: 10 Pages: 986-995 Year: OCT 1997 Times Cited: 11
added
16-Sep-08
7.
Title: Characteristics of current crowding in flip-chip solder bumps Author(s): LAI, YS; KAO, CL Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 915-922 Year: MAY-JUN 2006 Times Cited: 10
added
02-Jun-08
8.
Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Author(s): HUANG, AT; TU, KN; LAI, YS Source: JOURNAL OF APPLIED PHYSICS Volume: 100 Issue: 3 Year: AUG 1 2006 Times Cited: 9
Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Author(s): YEH, CL; LAI, YS Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 10 Pages: 1892-1901 Year: OCT 2006 Times Cited: 8
