Title: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages Author(s): LAI, YS; KAO, CL Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 8 Pages: 1357-1368 Published: AUG 2006 Times Cited: 22 DOI: 10.1016/j.microrel.2005.08.009
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Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Author(s): HUANG, AT; TU, KN; LAI, YS Source: JOURNAL OF APPLIED PHYSICS Volume: 100 Issue: 3 Published: AUG 1 2006 Times Cited: 22 DOI: 10.1063/1.2227621
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8.
Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Author(s): YEH, CL; LAI, YS Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 10 Pages: 1892-1901 Published: OCT 2006 Times Cited: 22
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9.
Title: Characteristics of current crowding in flip-chip solder bumps Author(s): LAI, YS; KAO, CL Source: MICROELECTRONICS RELIABILITY Volume: 46 Issue: 5-6 Pages: 915-922 Published: MAY-JUN 2006 Times Cited: 21 DOI: 10.1016/j.microrel.2005.02.007
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10.
Title: Local melting induced by electromigration in flip-chip solder joints Author(s): TSAI, CM; LIN, YL; TSAI, JY; et al. Source: JOURNAL OF ELECTRONIC MATERIALS Volume: 35 Issue: 5 Pages: 1005-1009 Published: MAY 2006 Times Cited: 20
