Title: Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Author(s): Lai, Yi-Shao; Chen, Kuo-Ming; Kao, Chin-Li; et al. Source: Microelectronics Reliability Volume: 47 Issue: 8 Pages: 1273-1279 Published: AUG 2007 Times Cited: 26 DOI: 10.1016/j.microrel.2006.09.023
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Title: Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Author(s): Yeh, Chang-Lin; Lai, Yi-Shao Source: Journal of Electronic Materials Volume: 35 Issue: 10 Pages: 1892-1901 Published: OCT 2006 Times Cited: 26 DOI: 10.1007/s11664-006-0173-2
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Title: Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints Author(s): Huang, Annie T.; Tu, K. N.; Lai, Yi-Shao Source: Journal of Applied Physics Volume: 100 Issue: 3 Published: AUG 1 2006 Times Cited: 26 DOI: 10.1063/1.2227621
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Title: Local melting induced by electromigration in flip-chip solder joints Author(s): Tsai, CM; Lin, YL; Tsai, JY; et al. Source: Journal of Electronic Materials Volume: 35 Issue: 5 Pages: 1005-1009 Published: MAY 2006 Times Cited: 26 DOI: 10.1007/BF02692560
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Title: Nanoindentation identifications of mechanical properties Of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples Author(s): Yang, Ping-Feng; Lai, Yi-Shao; Jian, Sheng-Rui; et al. Source: Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing Volume: 485 Issue: 1-2 Pages: 305-310 Published: JUN 25 2008 Times Cited: 24 DOI: 10.1016/j.msea.2007.07.093