Title: Low dielectric constant materials for ULSI interconnects Author(s): MORGEN, M; RYAN, ET; ZHAO, JH; et al. Source: ANNUAL REVIEW OF MATERIALS SCIENCE Volume: 30 Pages: 645-680 Year: 2000 Times Cited: 145
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2.
Title: D-CENTERS IN SPHERICAL QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; DUAN, WH; et al. Source: PHYSICAL REVIEW B Volume: 46 Issue: 12 Pages: 7546-7550 Year: SEP 15 1992 Times Cited: 43
added
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3.
Title: DIMENSIONALITY AND POTENTIAL-SHAPE EFFECTS ON D0 AND D- GROUND-STATES IN QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ Source: PHYSICAL REVIEW B Volume: 50 Issue: 3 Pages: 1832-1838 Year: JUL 15 1994 Times Cited: 37
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4.
Title: Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films Author(s): ZHAO, JH; RYAN, T; HO, PS; et al. Source: JOURNAL OF APPLIED PHYSICS Volume: 85 Issue: 9 Pages: 6421-6424 Year: MAY 1 1999 Times Cited: 35
added
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5.
Title: Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films Author(s): ZHAO, JH; MALIK, I; RYAN, T; et al. Source: APPLIED PHYSICS LETTERS Volume: 74 Issue: 7 Pages: 944-946 Year: FEB 15 1999 Times Cited: 33
added
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6.
Title: Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates Author(s): ZHAO, JH; DU, Y; MORGEN, M; et al. Source: JOURNAL OF APPLIED PHYSICS Volume: 87 Issue: 3 Pages: 1575-1577 Year: FEB 1 2000 Times Cited: 24
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7.
Title: NEUTRAL AND NEGATIVE DONORS IN QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ Source: JOURNAL OF PHYSICS-CONDENSED MATTER Volume: 6 Issue: 27 Pages: 5097-5103 Year: JUL 4 1994 Times Cited: 21
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8.
Title: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures Author(s): ZHAO, HH; QI, WH; HO, PS Source: MICROELECTRONICS RELIABILITY Volume: 42 Issue: 1 Pages: 27-34 Year: JAN 2002 Times Cited: 17
added
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9.
Title: Thermal stress and glass transition of ultrathin polystyrene films Author(s): ZHAO, JH; KIENE, M; HU, C; et al. Source: APPLIED PHYSICS LETTERS Volume: 77 Issue: 18 Pages: 2843-2845 Year: OCT 30 2000 Times Cited: 15 DOI: PII [S0003-6951(00)03244-7]
added
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10.
Title: Packaging effects on reliability of Cu/Low-k interconnects Author(s): WANG, GT; MERRILL, C; ZHAO, JH; et al. Source: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY Volume: 3 Issue: 4 Pages: 119-128 Year: DEC 2003 Times Cited: 12 DOI: 10.1109/TDMR.2003.820794
