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ResearcherID: B-2899-2008 Last / Family Name: First / Given Name:
Other Names: Jeff Zhao
E-mail:
URL: http://www.researcherid.com/rid/B-2899-2008
Subject: Engineering ; Materials Science ; Mathematical & Computational Biology ; Metallurgy & Metallurgical Engineering ; Physics ; Science & Technology - Other ; Thermodynamics
My Institutions (more details)
Primary Institution:
Sub-org/Dept: Semiconductor Packaging Technology Research
Role:
Past Institutions: Tsinghua University ; Tsinghua University ; Tsinghua University ; University of Texas at Austin ; Freescale Semiconductor, Inc. (Previously Motorola Semiconductor Products Sector)
Description:

Publication List Citation Metrics
publication(s)
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1. Title: Low dielectric constant materials for ULSI interconnects
Author(s): MORGEN, M; RYAN, ET; ZHAO, JH; et al.
Source: ANNUAL REVIEW OF MATERIALS SCIENCE Volume: 30 Pages: 645-680 Year: 2000
Times Cited: 145
added
16-Aug-08
2. Title: D-CENTERS IN SPHERICAL QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; DUAN, WH; et al.
Source: PHYSICAL REVIEW B Volume: 46 Issue: 12 Pages: 7546-7550 Year: SEP 15 1992
Times Cited: 43
added
16-Aug-08
3. Title: DIMENSIONALITY AND POTENTIAL-SHAPE EFFECTS ON D0 AND D- GROUND-STATES IN QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ
Source: PHYSICAL REVIEW B Volume: 50 Issue: 3 Pages: 1832-1838 Year: JUL 15 1994
Times Cited: 37
added
16-Aug-08
4. Title: Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
Author(s): ZHAO, JH; RYAN, T; HO, PS; et al.
Source: JOURNAL OF APPLIED PHYSICS Volume: 85 Issue: 9 Pages: 6421-6424 Year: MAY 1 1999
Times Cited: 35
added
16-Aug-08
5. Title: Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films
Author(s): ZHAO, JH; MALIK, I; RYAN, T; et al.
Source: APPLIED PHYSICS LETTERS Volume: 74 Issue: 7 Pages: 944-946 Year: FEB 15 1999
Times Cited: 33
added
16-Aug-08
6. Title: Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates
Author(s): ZHAO, JH; DU, Y; MORGEN, M; et al.
Source: JOURNAL OF APPLIED PHYSICS Volume: 87 Issue: 3 Pages: 1575-1577 Year: FEB 1 2000
Times Cited: 24
added
16-Aug-08
7. Title: NEUTRAL AND NEGATIVE DONORS IN QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ
Source: JOURNAL OF PHYSICS-CONDENSED MATTER Volume: 6 Issue: 27 Pages: 5097-5103 Year: JUL 4 1994
Times Cited: 21
added
16-Aug-08
8. Title: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
Author(s): ZHAO, HH; QI, WH; HO, PS
Source: MICROELECTRONICS RELIABILITY Volume: 42 Issue: 1 Pages: 27-34 Year: JAN 2002
Times Cited: 17
added
16-Aug-08
9. Title: Thermal stress and glass transition of ultrathin polystyrene films
Author(s): ZHAO, JH; KIENE, M; HU, C; et al.
Source: APPLIED PHYSICS LETTERS Volume: 77 Issue: 18 Pages: 2843-2845 Year: OCT 30 2000
Times Cited: 15
DOI: PII [S0003-6951(00)03244-7]
added
16-Aug-08
10. Title: Packaging effects on reliability of Cu/Low-k interconnects
Author(s): WANG, GT; MERRILL, C; ZHAO, JH; et al.
Source: IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY Volume: 3 Issue: 4 Pages: 119-128 Year: DEC 2003
Times Cited: 12
DOI: 10.1109/TDMR.2003.820794
added
16-Aug-08
publication(s)
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