Title: Low dielectric constant materials for ULSI interconnects Author(s): Morgen, M.; Ryan, E. T.; Zhao, J. H.; et al. Source: Annual Review of Materials Science Volume: 30 Pages: 645-680 Published: 2000 Times Cited: 217
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Title: D-CENTERS IN SPHERICAL QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; DUAN, WH; et al. Source: PHYSICAL REVIEW B Volume: 46 Issue: 12 Pages: 7546-7550 Published: SEP 15 1992 Times Cited: 50
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Title: Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films Author(s): Zhao, J. H.; Ryan, T.; Ho, P. S.; et al. Source: Journal of Applied Physics Volume: 85 Issue: 9 Pages: 6421-6424 Published: 1999 Times Cited: 47
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Title: Packaging effects on reliability of Cu/Low-k interconnects Author(s): Wang, G. T.; Merrill, C.; Zhao, J. H.; et al. Source: IEEE Transactions on Device and Materials Reliability Volume: 3 Issue: 4 Pages: 119-128 Published: 2003 Times Cited: 43
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Title: DIMENSIONALITY AND POTENTIAL-SHAPE EFFECTS ON D0 AND D- GROUND-STATES IN QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ Source: PHYSICAL REVIEW B Volume: 50 Issue: 3 Pages: 1832-1838 Published: JUL 15 1994 Times Cited: 41
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Title: Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films Author(s): Zhao, J. H.; Malik, I.; Ryan, T.; et al. Source: Applied Physics Letters Volume: 74 Issue: 7 Pages: 944-946 Published: 1999 Times Cited: 40
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Title: Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates Author(s): Zhao, J. H.; Du, Y.; Morgen, M.; et al. Source: Journal of Applied Physics Volume: 87 Issue: 3 Pages: 1575-1577 Published: 2000 Times Cited: 35
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Title: NEUTRAL AND NEGATIVE DONORS IN QUANTUM DOTS Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ Source: JOURNAL OF PHYSICS-CONDENSED MATTER Volume: 6 Issue: 27 Pages: 5097-5103 Published: JUL 4 1994 Times Cited: 34
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9.
Title: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures Author(s): Zhao, J. H.; Qi, W. H.; Ho, P. S. Source: Microelectronics Reliability Volume: 42 Issue: 1 Pages: 27-34 Published: 2002 Times Cited: 31
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Title: Reliability issues for flip-chip packages Author(s): Ho, P. S.; Wang, G. T.; Ding, M.; et al. Source: Microelectronics Reliability Volume: 44 Issue: 5 Pages: 719-737 Published: 2004 Times Cited: 21
