ResearcherID.com
ResearcherID
Zhao, Jie-Hua
Create a ResearcherID badge for this researcher Go to ResearcherID Labs for this researcher
Close
ResearcherID: B-2899-2008
Other Names: Jeff Zhao
E-mail:
URL: http://www.researcherid.com/rid/B-2899-2008
Subject: Engineering; Materials Science; Mathematical & Computational Biology; Metallurgy & Metallurgical Engineering; Physics; Science & Technology - Other; Thermodynamics
Keywords: fracture; elasticity; plasticity; viscoelasticity ; viscoplasticity; solders; reliability; electromigration; creep; diffusion; moire; low-k; interconnect modeling; microelectronics, nanoelectronics, optoelectronics; electronic packaging
My Institutions (more details)
Primary Institution:
Sub-org/Dept: Semiconductor Packaging Technology Research
Role:
Past Institutions: Freescale Semiconductor, Inc. (Previously Motorola Semiconductor Products Sector); Motorola, Inc.; Tsinghua University; Tsinghua University; Tsinghua University; University of Texas at Austin
Description:
 

Publications

My Publications (25)

 
Publication List: View
publication(s)  
First Page Previous Page Page   of  3  Go Next Page Last Page
  Sort by: 
Results per page: 
1. Title: Low dielectric constant materials for ULSI interconnects
Author(s): Morgen, M.; Ryan, E. T.; Zhao, J. H.; et al.
Source: Annual Review of Materials Science Volume: 30 Pages: 645-680 Published: 2000
Times Cited: 217
added
31-Dec-69
2. Title: D-CENTERS IN SPHERICAL QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; DUAN, WH; et al.
Source: PHYSICAL REVIEW B Volume: 46 Issue: 12 Pages: 7546-7550 Published: SEP 15 1992
Times Cited: 50
added
15-Aug-08
3. Title: Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
Author(s): Zhao, J. H.; Ryan, T.; Ho, P. S.; et al.
Source: Journal of Applied Physics Volume: 85 Issue: 9 Pages: 6421-6424 Published: 1999
Times Cited: 47
added
31-Dec-69
4. Title: Packaging effects on reliability of Cu/Low-k interconnects
Author(s): Wang, G. T.; Merrill, C.; Zhao, J. H.; et al.
Source: IEEE Transactions on Device and Materials Reliability Volume: 3 Issue: 4 Pages: 119-128 Published: 2003
Times Cited: 43
added
31-Dec-69
5. Title: DIMENSIONALITY AND POTENTIAL-SHAPE EFFECTS ON D0 AND D- GROUND-STATES IN QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ
Source: PHYSICAL REVIEW B Volume: 50 Issue: 3 Pages: 1832-1838 Published: JUL 15 1994
Times Cited: 41
added
15-Aug-08
6. Title: Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films
Author(s): Zhao, J. H.; Malik, I.; Ryan, T.; et al.
Source: Applied Physics Letters Volume: 74 Issue: 7 Pages: 944-946 Published: 1999
Times Cited: 40
added
31-Dec-69
7. Title: Simultaneous measurement of Young's modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates
Author(s): Zhao, J. H.; Du, Y.; Morgen, M.; et al.
Source: Journal of Applied Physics Volume: 87 Issue: 3 Pages: 1575-1577 Published: 2000
Times Cited: 35
added
31-Dec-69
8. Title: NEUTRAL AND NEGATIVE DONORS IN QUANTUM DOTS
Author(s): ZHU, JL; ZHAO, JH; XIONG, JJ
Source: JOURNAL OF PHYSICS-CONDENSED MATTER Volume: 6 Issue: 27 Pages: 5097-5103 Published: JUL 4 1994
Times Cited: 34
added
15-Aug-08
9. Title: Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures
Author(s): Zhao, J. H.; Qi, W. H.; Ho, P. S.
Source: Microelectronics Reliability Volume: 42 Issue: 1 Pages: 27-34 Published: 2002
Times Cited: 31
added
31-Dec-69
10. Title: Reliability issues for flip-chip packages
Author(s): Ho, P. S.; Wang, G. T.; Ding, M.; et al.
Source: Microelectronics Reliability Volume: 44 Issue: 5 Pages: 719-737 Published: 2004
Times Cited: 21
added
31-Dec-69
publication(s)  
First Page Previous Page Page   of  3  Go Next Page Last Page
  Sort by: 
Results per page: 
Published by Thomson Reuters