Title: Atomistic simulation and continuum modeling of graphene nanoribbons under uniaxial tension Author(s): Lu, Qiang; Gao, Wei; Huang, Rui Source: Modelling and Simulation in Materials Science and Engineering Volume: 19 Issue: 5 Published: 2011 Times Cited: 1 DOI: 05400610.1088/0965-0393/19/5/054006
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17-Jul-11
2.
Title: Concomitant wrinkling and buckle-delamination of elastic thin films on compliant substrates Author(s): Mei, Haixia; Landis, Chad M.; Huang, Rui Source: Mechanics of Materials Volume: 43 Issue: 11 Pages: 627-642 Published: NOV 2011 Times Cited: 0 DOI: 10.1016/j.mechmat.2011.08.003
added
19-Dec-11
3.
Title: Effect of surface roughness on adhesion of graphene membranes Author(s): Gao, W.; Huang, R. Source: Journal of Physics D-Applied Physics Volume: 44 Issue: 45 Pages: 4 Published: 2011 Times Cited: 0 DOI: 45200110.1088/0022-3727/44/45/452001
added
05-Dec-11
4.
Title: GRAPHENE Show of adhesive strength Author(s): Huang, Rui Source: Nature Nanotechnology Volume: 6 Issue: 9 Pages: 537-538 Published: SEP 2011 Times Cited: 0 DOI: 10.1038/nnano.2011.150
added
03-Oct-11
5.
Title: Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects Author(s): Ryu, SK; Lu, KH; Zhang, XF; et al. Source: Ieee Transactions on Device and Materials Reliability Volume: 11 Issue: 1 Pages: 35-43 Published: 2011 Times Cited: 5 DOI: 10.1109/TDMR.2010.2068572
added
19-Apr-11
6.
Title: Stress-Induced Delamination Of Through Silicon Via Structures Author(s): Ryu, Suk-Kyu; Lu, Kuan-Hsun; Im, Jay; et al. Source: Stress Management For 3d Ics Using Through Silicon Vias: International Workshop on Stress Management For 3d Ics Using Through Silicon Vias Volume: 1378 Pages: 153-167 Published: 2011 Times Cited: 0 DOI: 10.1063/1.3615702
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05-Dec-11
7.
Title: Stretch-induced stress patterns and wrinkles in hyperelastic thin sheets Author(s): Nayyar, Vishal; Ravi-Chandar, K.; Huang, Rui Source: International Journal of Solids and Structures Volume: 48 Issue: 25-26 Pages: 3471-3483 Published: DEC 15 2011 Times Cited: 0 DOI: 10.1016/j.ijsolstr.2011.09.004
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19-Dec-11
8.
Title: Swelling behavior of nanoscale, shape- and size-specific, hydrogel particles fabricated using imprint lithography Author(s): Caldorera-Moore, M; Kang, MK; Moore, Z; et al. Source: Soft Matter Volume: 7 Issue: 6 Pages: 2879-2887 Published: 2011 Times Cited: 0 DOI: 10.1039/c0sm01185a
added
19-Apr-11
9.
Title: SWELLING-INDUCED INSTABILITY OF SUBSTRATE-ATTACHED HYDROGEL LINES Author(s): Kang, Min Kyoo; Huang, Rui Source: International Journal of Applied Mechanics Volume: 3 Issue: 2 Pages: 219-233 Published: 2011 Times Cited: 0 DOI: 10.1142/s1758825111000956
added
17-Jul-11
10.
Title: Thermomechanical Reliability of Through-Silicon Vias in 3D Interconnects Author(s): Lu, Kuan-Hsun; Ryu, Suk-Kyu; Im, Jay; et al. Source: 2011 Ieee International Reliability Physics Symposium (Irps) Published: 2011 Times Cited: 0
