Title: An anti-interpenetration model and connections between interphase and interface models in particle-reinforced composites Author(s): WANG, J; DUAN, HL; ZHANG, Z; et al. Source: INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES Volume: 47 Issue: 4-5 Pages: 701-718 Published: APR-MAY 2005 Times Cited: 19 DOI: 10.1016/j.ijmecsci.2004.12.014
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18-Apr-08
2.
Title: Split singularities and the competition between crack penetration and debond at a bimaterial interface Author(s): ZHANG, Z; SUO, ZG Source: INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES Volume: 44 Issue: 13 Pages: 4559-4573 Published: JUN 15 2007 Times Cited: 7 DOI: 10.1016/j.ijsolstr.2006.11.035
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18-Apr-08
3.
Title: Saturated voids in interconnect lines due to thermal strains and electromigration Author(s): ZHANG, Z; SUO, ZG; HE, J Source: JOURNAL OF APPLIED PHYSICS Volume: 98 Issue: 7 Pages: - Published: OCT 1 2005 Times Cited: 6 DOI: 10.1063/1.2061896
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18-Apr-08
4.
Title: Method to analyze dislocation injection from sharp features in strained silicon structures Author(s): ZHANG, Z; YOON, J; SUO, ZG Source: APPLIED PHYSICS LETTERS Volume: 89 Issue: 26 Pages: - Published: DEC 25 2006 Times Cited: 5 DOI: 10.1063/1.2424665
added
18-Apr-08
5.
Title: Time-dependent crack behavior in an integrated structure Author(s): LIANG, J; ZHANG, Z; PREVOST, JH; et al. Source: INTERNATIONAL JOURNAL OF FRACTURE Volume: 125 Issue: 3-4 Pages: 335-348 Published: FEB 2004 Times Cited: 5
added
18-Apr-08
6.
Title: Split singularities and dislocation injection in strained silicon Author(s): FERON, M; ZHANG, Z; SUO, ZG Source: JOURNAL OF APPLIED PHYSICS Volume: 102 Issue: 2 Pages: - Published: JUL 15 2007 Times Cited: 2 DOI: 10.1063/1.2753674
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18-Apr-08
7.
Title: The effect of coating in increasing the critical size of islands on a compliant substrate Author(s): YOON, J; ZHANG, Z; LU, NS; et al. Source: APPLIED PHYSICS LETTERS Volume: 90 Issue: 21 Pages: - Published: MAY 21 2007 Times Cited: 1 DOI: 10.1063/1.2742911
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18-Apr-08
8.
Title: Split singularities: Applications and implications Author(s): ZHANG, Z; SUO, ZG Conference: ASME International Mechanical Engineering Congress and Exposition Pages: 811-819 Year: 2008 Times Cited: 0
added
23-Apr-09
9.
Title: 3D fracture mechanics analysis of underfill delamination for flip chip packages Author(s): ZHANG, Z; ZHAI, CJ; MASTER, RN Conference: 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Pages: 751-755 Year: 2008 Times Cited: 0
added
23-Apr-09
10.
Title: Methodology for avoidance of ratcheting-induced stable cracking (RISC) in microelectronic devices Author(s): ZHANG, Z; SUO, ZG; LIU, Y; et al. Conference: 56th Electronic Components and Technology Conference Pages: 1429-1435 Year: 2006 Times Cited: 0
