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Zhang, Yihui
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ResearcherID: G-9876-2011
Other Names: Zhang, Y.H.; Zhang, Y.
URL: http://www.researcherid.com/rid/G-9876-2011
Subject: Engineering; Materials Science; Mechanics
Keywords: solid mechanics; buckling and postbuckling; mechanically-guided 3d assembly; stretchable electronics; architected materials; soft active materials; ferroelectrics
ORCID: http://orcid.org/0000-0003-0885-2067
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Past Institutions: Northwestern University; Northwestern University; Tsinghua University; nanjing university of aeronautics and astronautics
My URLs: http://www.yihuizhang.org/
 
 

This list contains papers that I have authored.

publication(s)  
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1.  Title: A double perturbation method of postbuckling analysis in 2D curved beams for assembly of 3D ribbon-shaped structures
 Author(s): Fan, Zhichao; Hwang, Keh-Chih; Rogers, John A.; et al.
 Source: Journal of the Mechanics and Physics of Solids Volume: 111 Pages: 215-238 Published: FEB 2018
 Times Cited: 1
 DOI: 10.1016/j.jmps.2017.10.012
added
22-Feb-18
2.  Title: Fabrication and Deformation of 3D Multilayered Kirigami Microstructures
 Author(s): Humood, Mohammad; Shi, Yan; Han, Mengdi; et al.
 Source: Small Volume: 14 Issue: 11 Published: MAR 15 2018
 Times Cited: 1
 DOI: 10.1002/smll.201703852
added
03-Apr-18
3.  Title: Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics
 Author(s): Fu, Haoran; Nan, Kewang; Bai, Wubin; et al.
 Source: Nature Materials Volume: 17 Issue: 3 Pages: 268-+ Published: MAR 2018
 Times Cited: 3
 DOI: 10.1038/s41563-017-0011-3
added
17-Mar-18
4.  Title: Soft network materials with isotropic negative Poisson's ratios over large strains
 Author(s): Liu, Jianxing; Zhang, Yihui
 Source: Soft Matter Volume: 14 Issue: 5 Pages: 693-703 Published: FEB 7 2018
 Times Cited: 0
 DOI: 10.1039/c7sm02052j
added
22-Feb-18
5.  Title: Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
 Author(s): Kim, Bong Hoon; Lee, Jungyup; Won, Sang Min; et al.
 Source: Acs Nano Volume: 12 Issue: 5 Pages: 4164-4171 Published: MAY 2018
 Times Cited: 0
added
12-Jun-18
6.  Title: Vibration of mechanically-assembled 3D microstructures formed by compressive buckling
 Author(s): Wang, Heling; Ning, Xin; Li, Haibo; et al.
 Source: Journal of the Mechanics and Physics of Solids Volume: 112 Pages: 187-208 Published: MAR 2018
 Times Cited: 0
 DOI: 10.1016/j.jmps.2017.12.002
added
23-Mar-18
7.  Title: 3D Tunable, Multiscale, and Multistable Vibrational Micro-Platforms Assembled by Compressive Buckling
 Author(s): Ning, Xin; Wang, Heling; Yu, Xinge; et al.
 Source: Advanced Functional Materials Volume: 27 Issue: 14 Published: APR 11 2017
 Times Cited: 8
 DOI: 10.1002/adfm.201605914
added
16-Apr-17
8.  Title: Chemical Sensing Systems that Utilize Soft Electronics on Thin Elastomeric Substrates with Open Cellular Designs
 Author(s): Lee, Yoon Kyeung; Jang, Kyung-In; Ma, Yinji; et al.
 Source: Advanced Functional Materials Volume: 27 Issue: 9 Published: MAR 3 2017
 Times Cited: 14
 DOI: 10.1002/adfm.201605476
added
30-Mar-17
9.  Title: Design and application of 'J-shaped' stress-strain behavior in stretchable electronics: a review
 Author(s): Ma, Yinji; Feng, Xue; Rogers, John A.; et al.
 Source: Lab on a Chip Volume: 17 Issue: 10 Pages: 1689-1704 Published: MAY 21 2017
 Times Cited: 8
 DOI: 10.1039/c7lc00289k
added
05-Jun-17
10.  Title: Deterministic assembly of 3D mesostructures in advanced materials via compressive buckling: A short review of recent progress
 Author(s): Yan, Zheng; Han, Mengdi; Yang, Yiyuan; et al.
 Source: Extreme Mechanics Letters Volume: 11 Pages: 96-104 Published: FEB 2017
 Times Cited: 9
 DOI: 10.1016/j.eml.2016.12.006
added
05-Jun-17
publication(s)  
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