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Nagao, Shijo
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ResearcherID: E-4870-2012
E-mail:
URL: http://www.researcherid.com/rid/E-4870-2012
Subject: Crystallography; Materials Science; Mechanics; Physics; Polymer Science
Keywords: nanomechanics; materials; physics
ORCID: http://orcid.org/0000-0002-2764-3458
My Institutions (more details)
Primary Institution:
Sub-org/Dept: The Institute of Scientific and Industrial Research; Advance Intterconnection Materials
Role:
Past Institutions: Norwegian University of Science and Technology; Kyushu Univerisity; Helsinki Univerisity of Technology
Description:
My URLs: http://no.linkedin.com/pub/shijo-nagao/50/a35/555/en
http://eco.sanken.osaka-u.ac.jp/
 
 

This list contains papers that I have authored.

publication(s)  
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1.  Title: Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
 Author(s): Gao, Yue; Zhang, Hao; Li, Wanli; et al.
 Source: Journal of Electronic Materials Volume: 46 Issue: 7 Pages: 4575-4581 Published: JUL 2017
 Times Cited: 0
 DOI: 10.1007/s11664-017-5464-2
added
19-Jul-17
2.  Title: Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution
 Author(s): Wang, Zhenghong; Chen, Chuantong; Jiu, Jinting; et al.
 Source: Journal of Alloys and Compounds Volume: 716 Pages: 231-239 Published: SEP 5 2017
 Times Cited: 0
 DOI: 10.1016/j.jallcom.2017.04.281
added
19-Jul-17
3.  Title: Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement
 Author(s): Li, Wanli; Zhang, Hao; Gao, Yue; et al.
 Source: Journal of Materials Chemistry C Volume: 5 Issue: 5 Pages: 1155-1164 Published: 2017
 Times Cited: 1
 DOI: 10.1039/c6tc04892g
added
19-Jul-17
4.  Title: Highly thermostable joint of a Cu/Ni-P plating/Sn-0.7Cu solder added with Cu balls
 Author(s): Kadoguchi, Takuya; Take, Naoya; Yamanaka, Kimihiro; et al.
 Source: Journal of Materials Science Volume: 52 Issue: 6 Pages: 3244-3254 Published: MAR 2017
 Times Cited: 0
 DOI: 10.1007/s10853-016-0613-1
added
19-Jul-17
5.  Title: Investigation of thermal transport in polymer composites with percolating networks of silver thin films by the flash diffusivity method
 Author(s): Pettersen, Sigurd R.; Nagao, Shijo; Kristiansen, Helge; et al.
 Source: Journal of Applied Physics Volume: 121 Issue: 2 Published: JAN 14 2017
 Times Cited: 0
 DOI: 10.1063/1.4973682
added
19-Jul-17
6.  Title: Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices
 Author(s): Chen, Chuantong; Nagao, Shijo; Suganuma, Katsuaki; et al.
 Source: Acta Materialia Volume: 129 Pages: 41-51 Published: MAY 1 2017
 Times Cited: 1
 DOI: 10.1016/j.actamat.2017.02.065
added
19-Jul-17
7.  Title: Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
 Author(s): Chen, Chuantong; Nagao, Shijo; Zhang, Hao; et al.
 Source: Journal of Electronic Materials Volume: 46 Issue: 3 Pages: 1576-1586 Published: MAR 2017
 Times Cited: 1
 DOI: 10.1007/s11664-016-5200-3
added
19-Jul-17
8.  Title: Modifying the valence state of molybdenum in the efficient oxide buffer layer of organic solar cells via a mild hydrogen peroxide treatment
 Author(s): Cong, Shuren; Hadipour, Afshin; Sugahara, Tohru; et al.
 Source: Journal of Materials Chemistry C Volume: 5 Issue: 4 Pages: 889-895 Published: 2017
 Times Cited: 1
 DOI: 10.1039/c6tc04461a
added
19-Jul-17
9.  Title: Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices
 Author(s): Zhang, Hao; Chen, Chuantong; Nagao, Shijo; et al.
 Source: Journal of Electronic Materials Volume: 46 Issue: 2 Pages: 1055-1060 Published: FEB 2017
 Times Cited: 1
 DOI: 10.1007/s11664-016-5069-1
added
19-Jul-17
10.  Title: Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives
 Author(s): Pettersen, Sigurd R.; Kristiansen, Helge; Nagao, Shijo; et al.
 Source: Journal of Electronic Materials Volume: 45 Issue: 7 Pages: 3734-3743 Published: JUL 2016
 Times Cited: 3
 DOI: 10.1007/s11664-016-4498-1
added
19-Oct-16
publication(s)  
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